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Solder Balls 0.45mm BGA Reballing Leaded Solder Balls 250 Thousand Grains Tin...

$ 20.67

Availability: 100 in stock
  • Return shipping will be paid by: Seller
  • Refund will be given as: Money Back
  • All returns accepted: Returns Accepted
  • MPN: Does not apply
  • Item must be returned within: 30 Days
  • Brand: Thincol
  • Model: Does not apply
  • Condition: New

    Description

    Solder Balls, 0.45mm BGA Reballing Leaded Solder Balls, 250 Thousand Grains, Tin ball for Semiconductor Chip, Circuit Board and the PCB Board, Electronic Part (tin 63%, lead 37%)
    Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit
    Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic signals with ultra‑small ball tin electronic parts, etc.
    The solder with leaded tin balls is more durable and can help you solder effectively
    Small size, easy to carry and , convenient to use and with good performance
    250 thousand grains, a large number, can meet your use and needs, very practically
    Specification: Item Type: Leaded Solder Balls Product Composition: Sn63/Pb37 (tin 63%/lead 37%)Specification: Approx.0.45mm / 0.02in 250,000 grainsUses: Chip planting beads, ball plantingScope of Application: BGA package soldering, filling, maintenance, ball plantingFeatures: Add trace elements to improve the oxidation ability and reliability of the solder ball pit.Description: The tin ball is mainly connected with the semiconductor chip, the circuit template and the PCB board, and the ultra-small ball-type tin electronic part that transmits the electronic signal.Tin Ball Diameter for IC Packaging: Approx. 0.2 ~ 0.76mm / 0.01 ~ 0.03in Package List:1 Bottle Leaded Solder Balls
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