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Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair

Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair

$ 5.27

Availability: 100 in stock
  • Brand: None
  • Return shipping will be paid by: Buyer
  • All returns accepted: Returns Accepted
  • Particle Size: 1-10μm
  • Origin: CN(Origin)
  • Item must be returned within: 30 Days
  • Application 1: For iPhone hard disk
  • MPN: Does Not Apply
  • Refund will be given as: Money back or replacement (buyer's choice)
  • Model Number: Qianli 3D Stencil
  • Condition: New

    Description

    Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
    Qinali 3D Universal BGA Reballing Stencil for iPhone Hard Disk NAND Repair Solder Template Tin Plant Steel Net
    Feature:
    1.3D laser square hole BGA reballing stencil template.
    2.High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,
    3.make steel net more durable,easier to take off the net,more efficient.
    Brand Name: None Origin: CN(Origin) Model Number: Qianli 3D Stencil Particle Size: 1-10μm Application 1: For iPhone hard disk