Qianli 3D iBlack BGA CPU Reballing Stencil Kit IC Chips BGA Motherboard Repair

Description

Qianli 3D iBlack BGA CPU Reballing Stencil Kit IC Chips BGA Motherboard Repair
Qianli 3D iBlack BGA CPU Stencil Reballing Stencil Kit IC Chips BGA Motherboard Repair for A7 A8 A9 A10 A11 A12 for iPhone 6 7 8 X
Feature:
1.3D laser square hole BGA reballing stencil template.
2.High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,
3.make steel net more durable,easier to take off the net,more efficient.
4.New patented iPhone X Middle Layer Motherboard for iPhone X Middle layer motherboard.
5.Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
Brand Name: None Origin: CN(Origin) Model Number: Qianli 3D Stencil Particle Size: 1-10μm Application 1: For iPhone A7/A8 /A9/10A/A11 Application 2: for Phone PCB Soldering Repair Application 3: BGA Rework Stencils Groove for iPhone Application 4: Planting Tin Template