QianLi 3D BGA Reballing Stencil Phone PCB Stencils Power Logic Module For IPhone

Description

QianLi 3D BGA Reballing Stencil iBlack Phone PCB Stencils Power Logic Module For IPhone 5 / 5S / 6 / 6S / 7 / 8 / X Repair Tools
Product Features:
1.laser square hole BGA reballing stencil template.
2.High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole
posttion,make steel net more durable,easier to take off the net,more efficient.
3.New patented iphone X Middle Layer Motherboard  for iPhone X Middle layer motherboard.
4.Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
OPTION:
option1:FOR 5 /5S
option2:FOR 6
option3:FOR 6S
option4:FOR 7
option5:FOR 8 /X