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MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU
MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU

MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-11 A8-A13 NAND CPU

$ 10.55

Availability: 140 in stock
  • Restocking Fee: No
  • Refund will be given as: Money Back
  • MPN: Does Not Apply
  • Condition: New
  • All returns accepted: Returns Accepted
  • Item must be returned within: 30 Days
  • Return shipping will be paid by: Buyer
  • Brand: Unbranded

    Description

    MECHANIC 3D BGA Reballing Gold Stencil Template For IPhone 6-8P 11-XS XSMAX XR A8-A13 NAND CPU Motherboard Soldering Repair Tool
    Feature
    1. 3D Groove design, Good for Reballing
    2.High Temperature Resistance of 700 Degrees, no bulge, no deformation
    3. The thickness of the whole mesh is 0.3mm
    4. The thickness of the groove is 0.18mm
    5.The thickness of tin plating is 0.12mm
    6.Anti-oxidation