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Layer Board BGA Reballing Stencil Plant Tin For A10 A11 A12 A13 CPU Solder Kit

Layer Board BGA Reballing Stencil Plant Tin For A10 A11 A12 A13 CPU Solder Kit

$ 62.19

Availability: 51 in stock
  • Model: Kaisi A10
  • Particle Size: 1-10μm
  • Condition: New
  • MPN: 9894657507
  • Brand: Unbranded
  • Color: BGA-A11
  • Country/Region of Manufacture: China
  • Item Type: Layer Board BGA Reballing Stencil Plant
  • Custom Bundle: No
  • Modified Item: No
  • Function: Motherboard Middle Layer Planting platform
  • Application: BGA Reballing Stencil for A10 A11 A12 A13

    Description

    Layer Board BGA Reballing Stencil Plant Tin For A10 A11 A12 A13 CPU Solder Kit
    Description
    Bottom layer Board BGA
    Reballing Stencil Plant Tin Platform
    for iPhone A10 A11 A12 A13
    CPU Solder Template kit
    Package Includes:
    Selected variation