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Dot Repairing Soldering Lug No Trace Repair High Saturation BGA Bonding Surface

$ 5.26

Availability: 27 in stock
  • Return shipping will be paid by: Buyer
  • Brand: Unbranded
  • All returns accepted: Returns Accepted
  • Refund will be given as: Money Back
  • Condition: New
  • MPN: Does Not Apply
  • Restocking Fee: No
  • Item must be returned within: 30 Days

    Description

    Dot Repairing Soldering Lug No Trace Repair High Saturation BGA Bonding Surface
    Features: 100% brand new and high quality
    The pad strengthens the fixed pin, which will never fall off.
    Adopt industrial grade printed circuit board copper foil with a thickness of 30μm.
    Good flatness, effectively preventing false welding caused by unevenness.
    BGA bonding surface has high saturation, stable electrical performance, good welding strength, and it is not easy to drop and unsolder.
    It saves time and effort, saves the trouble of flying wires and loops, and has high maintenance efficiency.
    Specification: Material: Copper
    Product Dimension: approx. 8X12X3 cm/ 3.15x4.72x1.18 inches
    Net weight: 15g/ 0.03 lbs
    Package Includes: 1PC Repair Spot Welding Piece
    note: Please allow 1-2cm errors due to manual measurement. Due to the difference between different monitors, the picture may not reflect the actual color of the item.