-40%
BGA Reballing Stencil for EMMC/EMCP BGA221 153 169 254 162 186 Reballing Templat

BGA Reballing Stencil for EMMC/EMCP BGA221 153 169 254 162 186 Reballing Templat

$ 8.44

Availability: 100 in stock
  • Return shipping will be paid by: Buyer
  • Condition: New
  • Thickness: 0.15mm
  • Country/Region of Manufacture: China
  • Style: BGA Stencil for EMMC EMCP
  • Item must be returned within: 30 Days
  • Model: 4107018890
  • MPN: Does not apply
  • All returns accepted: Returns Accepted
  • Brand: Unbranded
  • Material: Stainless Steel
  • Refund will be given as: Money Back
  • Function: BGA Stencil for BGA221 153 169 254 162 186
  • Particle Size: 1-10μm

    Description

    BGA Reballing Stencil for EMMC/EMCP BGA221 153 169 254 162 186 Reballing Template Soldering Net Thickness 0.15mm
    Description: High quality BGA Stencil.
    Specially designed for EMMC/EMCP BGA221 153 169 254 162 186 Make your repair work easier.
    Material: Stainless Steel
    Thickness:0.15mm
    Package: 1* BGA Stencil