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BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

$ 6.85

Availability: 42 in stock
  • Restocking Fee: No
  • application: Samsung HUAWEI HTC MTK Android
  • is_customized: No
  • Item must be returned within: 30 Days
  • Material: Cast Iron
  • Model Number: BGA Direct Heating Reballing Stenci
  • MPN: Does not apply
  • All returns accepted: Returns Accepted
  • Brand: Unbranded
  • Return shipping will be paid by: Buyer
  • Type: Reballing Stencil
  • Usage: Home DIY
  • Refund will be given as: Money Back
  • Condition: New

    Description

    PHONEFIX 12pcs Full Set BGA Reballing Stencil Template for Samsung Huawei MTK LG Xiaomi, Mobile Phone Rework Repair BGA Reballing Stencils soldering assistant, it is used for professional reballing operation on Samsung Huawei LG MTK Xiaomi Oppo Vivo BGA IC chips.