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BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

$ 6.85

Availability: 42 in stock
  • Usage: Home DIY
  • Brand: Unbranded
  • Return shipping will be paid by: Buyer
  • MPN: Does not apply
  • Condition: New
  • Item must be returned within: 30 Days
  • application: Samsung HUAWEI HTC MTK Android
  • Restocking Fee: No
  • is_customized: No
  • Refund will be given as: Money Back
  • Type: Reballing Stencil
  • Model Number: BGA Direct Heating Reballing Stenci
  • Material: Cast Iron
  • All returns accepted: Returns Accepted

    Description

    PHONEFIX 12pcs Full Set BGA Reballing Stencil Template for Samsung Huawei MTK LG Xiaomi, Mobile Phone Rework Repair BGA Reballing Stencils soldering assistant, it is used for professional reballing operation on Samsung Huawei LG MTK Xiaomi Oppo Vivo BGA IC chips.