250K 0.2mm~0.75 mm BGA Solder Ball BGA Reballing Balls Leaded IC Repair Kits

Description

250K 0.2mm~0.75 mm BGA Solder Ball BGA Reballing Balls Leaded IC Repair Kits
Features:
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Brand new and high quality.
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Solder (Tin) paste is the best choice of reballing IC.
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It is used instead of the pin in the IC component package structure.
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Specification: 0.2mm~0.76 mm
(According to your choice)
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Quantity: 250,000Pcs per Bottle
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Leaded
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*
The picture is for reference only!
Package included:
1 Bottle
x
Solder Ball
(According to your choice)
Shipping
:
We only accept your Ebay Address,Please Make sure it's 100% right.
The items you ordered will be shipped out in 1 business day by Air Mail when your payment is clear.
Return Policy
:
If you are not satisfied with the item, please contact with us.
We will offer Full Refund to you when we receive your returned item.
Any problem, please feel free to contact with us.
Feedback
:
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If you have any problem or be not satisfied with them,please feel free to contact us,we will reply you within 24 hours.
Contact US
:
We care about our valued buyers, if you have any questions, our Customer Service staffs will be very glad to help you. We try our best to reply to your emails as soon as possible, however, due to high volume of daily incoming emails and time zone difference, we may not be able to reply your emails immediately. Please allow 24 business hours for us to response.
About item:For the functional products in our shop, we make sure that the functions are the same as description, but the actual color and shape may looks a little different from pictures because of the technical improvement and manufacturing variance. Please be advised before you bid.